Almost all electronic gadgets and devices have printed circuit boards as part of the components that constitute them. Manufacturing of PCB is not a difficult process and even amateur electricians can just provide the manufacturer with their own designs in order to get it done. The boards are divided into three categories; multi layer, single and double side boards. Conduction of these boards is usually done using copper, nickel or aluminum based material. The material is chosen depending on how complex or dense the circuits are. Described here is the process followed when going about creating them and the stages involved.
The backing is first plated using a conductive material. Into it, holes are drilled in order for the improvement of conduction in between the layers. Scrubbing of the board is performed to get rid of any unwanted small particles of the conductor. These are then recycled using such methods as filtration. In case the copper particles are not recycled, there could be serious environmental impact if it combines with the other wastes.
Cleaning of the board is then done. In the next stage, there should be adequate adhesion and therefore to enhance this, etching is also done. One more layer of conductor is added next. The holes that had been drilled earlier should be conducted; hence the application of electrolysis copper plating is vital. Acidic based solutions and alkaline ones are used so that the pH is properly balanced.
The circuit's final design is arrived at with the use of photo imaging. Electroplating copper also helps in arriving at the final required thickness. Application of a thin layer of tin or lead solder takes place to allow for the protection of the final circuits. Removal of the unwanted copper is done as it will not be part of the final circuit. Its etching can be carried out using an acidic or alkaline solution.
Other organic or photosensitive compounds can be used to obtain alternative resists. The compounds can be used when wet or dry. They will become hard when they are exposed to ultraviolet light.
The resists that are in liquid form can be applied using a roller, squeegee, spray or silk screen. This liquid can also be applied to the surface on one or both sides of the surface. Finer circuits can be achieved by using light.
The formation of multi layer panels is the final stage of this process. The inner cores of the layer are put together. The panels that are assembled together look like a copper foiled book with alternating epoxy sheets.
The book is positioned into a laminating press and then high pressure as well as heat is applied to it. The intense heat will eventually cause the sheets to melt down and a bond will be formed. Next, there are holes that are drilled into it. Prior to this, it should undergo some trimming and buffing. Manufacturing of PCB can only be successful if all these steps and guidelines are clearly followed to the latter.
The backing is first plated using a conductive material. Into it, holes are drilled in order for the improvement of conduction in between the layers. Scrubbing of the board is performed to get rid of any unwanted small particles of the conductor. These are then recycled using such methods as filtration. In case the copper particles are not recycled, there could be serious environmental impact if it combines with the other wastes.
Cleaning of the board is then done. In the next stage, there should be adequate adhesion and therefore to enhance this, etching is also done. One more layer of conductor is added next. The holes that had been drilled earlier should be conducted; hence the application of electrolysis copper plating is vital. Acidic based solutions and alkaline ones are used so that the pH is properly balanced.
The circuit's final design is arrived at with the use of photo imaging. Electroplating copper also helps in arriving at the final required thickness. Application of a thin layer of tin or lead solder takes place to allow for the protection of the final circuits. Removal of the unwanted copper is done as it will not be part of the final circuit. Its etching can be carried out using an acidic or alkaline solution.
Other organic or photosensitive compounds can be used to obtain alternative resists. The compounds can be used when wet or dry. They will become hard when they are exposed to ultraviolet light.
The resists that are in liquid form can be applied using a roller, squeegee, spray or silk screen. This liquid can also be applied to the surface on one or both sides of the surface. Finer circuits can be achieved by using light.
The formation of multi layer panels is the final stage of this process. The inner cores of the layer are put together. The panels that are assembled together look like a copper foiled book with alternating epoxy sheets.
The book is positioned into a laminating press and then high pressure as well as heat is applied to it. The intense heat will eventually cause the sheets to melt down and a bond will be formed. Next, there are holes that are drilled into it. Prior to this, it should undergo some trimming and buffing. Manufacturing of PCB can only be successful if all these steps and guidelines are clearly followed to the latter.
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